EVG|EVGroup.com

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EVG|EVGroup.com

www.evgroup.eu/

EV Group (EVG) targets advanced packaging, compound semiconductor and silicon-based power devices, MEMS, nanotechnology and SOI markets with its industry ...

Most Used Html Elements

<a> : 142
<li> : 134
<ul> : 46
<div> : 31
<script> : 15
<meta> : 10
<input> : 8
<p> : 8
<link> : 7
<img> : 7
<option> : 6
<hr> : 4
<span> : 3
<h3> : 2

Most Used Html Classes

"topitem" : 7
"hidden" : 5
"boxitem" : 3
"border" : 3
"heading" : 3
"clear" : 2
"componentlink" : 2

Where is www.evgroup.eu hosted?

Country:

Austria

City:

Wels

Registrar:

EURID

Latitude:

48.18

Longitude:

14.02

IP address:

85.31.6.130

IP Binary address:

1010101000111110000011010000010

IP Octal address:

12507603202

IP Hexadecimal address:

551f0682

Context analysis of evgroup.eu

Number of letters on this page:

2 268

Number of words on this page:

345

Number of sentences on this page:

7

Average words per sentences on this page:

49

Number of syllables on this page:

751

Domain name architecture

Domain name length:

10

Hyphens:

Domain doesn't contain hyphens!

Domain name with Hindi letters:

ए व ग र ओ उ प . ए उ

Domain name with Hebrew letters:

(e) ו ג ר (ο) (u) פּ . (e) (u)

Domain name with Cyrillic letters:

e в г р о у п . e у

Domain name with Arabic letters:

(e) (v) غ ر (o) (u) (p) . (e) (u)

Domain name with Greek letters:

ε (v) γ ρ ο υ π . ε υ

Domain name with Chinese letters:

伊维吉艾儿哦伊吾屁 . 伊伊吾

Domain without Consonants:

vgrp.

Domain without Vowels:

eou.eu

Alphabet positions:

e⁵ v²² g⁷ r¹⁸ o¹⁵ u²¹ p¹⁶ . e⁵ u²¹

Domain name pattern:
V: Vowel, C: Consonant, N: Number

V C C C V V C . V V

<HEAD> DATA INFORMATION

Encoding:

UTF-8

Content-Language:

en

robots:

index,follow

revisit-after:

2 weeks

author:

EVG

publisher:

EV Group

description:

EV Group (EVG) targets advanced packaging, compound semiconductor and silicon-based power devices, MEMS, nanotechnology and SOI markets with its industry-leading wafer-bonding, lithography/nanoimprint lighography (NIL), metrology, photoresist coating, cleaning and inspection equipment.

keywords:

EV Group, EVG, EVGroup, mask aligner, bond aligner, wafer bonder, coater, developer, wafer cleaner, nanoimprint lithography, inspection system, integrated system, lithography, nanotechnology, MEMS, SOI, Compound Semiconductors, power devices, advanced packaging, 3D interconnect, thin wafer processing, News

Internal links in evgroup.eu

#mainNav
#content
/en/
/en/login
/en/about/news/2017_08_EVG_Japan_20Years/
/en/about/news/2017_07_LaserDebonding/
/en/about/news/
/en/about/events/
http://www.evgroup.com/en/about/news/2017_06_VLSI_WP/
/en/about/
/en/about/vision
/en/about/awards/
/en/about/certificates/
/en/about/events/technologydays/
/en/about/history/
/en/about/evgnews/
/en/about/purchasing/
/en/about/purchasing/demands/
/en/about/purchasing/demands/mechanical
/en/about/purchasing/demands/electronics
/en/about/purchasing/demands/pneumatics
/en/about/purchasing/demands/fluidics
/en/about/purchasing/demands/vaccuum
/en/about/purchasing/demands/optical
/en/about/purchasing/conditions
/en/about/purchasing/requirements
/en/about/purchasing/purchasing_portal
/en/about/links
/en/about/social_responsibility/
/en/about/overview
/en/products/
/en/products/overview
/en/products/lithography/
/en/products/lithography/photolithography/
/en/products/lithography/photolithography/mask_aligners/
/en/products/lithography/photolithography/coaters_developers/
/en/products/lithography/photolithography/lithography_track_systems/
/en/products/lithography/photolithography/inspection_systems/
/en/products/lithography/nanoimprint_systems/
/en/products/lithography/nanoimprint_systems/hot_embossing/
/en/products/lithography/nanoimprint_systems/uv_nil/
/en/products/lithography/nanoimprint_systems/micro_contact_printing/
/en/products/bonding/
/en/products/bonding/waferbonding/
/en/products/bonding/bondalignment/
/en/products/bonding/integrated_bonding/
/en/products/bonding/soi_bonding/
/en/products/bonding/temporary_bonding/
/en/products/bonding/inspectionsystems/
/en/services/evg_application_lab/
/en/solutions/
/en/solutions/overview
/en/solutions/3d-ic/
/en/solutions/3d-ic/introduction
/en/solutions/3d-ic/chip_stacking
/en/solutions/3d-ic/advanced_c2w_bonding
/en/solutions/3d-ic/wafer_bonding
/en/solutions/3d-ic/thin_wafer_processing/
/en/solutions/3d-ic/thin_wafer_processing/introduction
/en/solutions/3d-ic/thin_wafer_processing/thermal_slide_off
/en/solutions/3d-ic/thin_wafer_processing/multilayer_adhesive_debonding
/en/solutions/3d-ic/thin_wafer_processing/lowtemp_zonebond/
/en/solutions/3d-ic/thin_wafer_processing/lowtemp_zonebond/introduction/
/en/solutions/3d-ic/thin_wafer_processing/lowtemp_zonebond/open_platform/
/en/solutions/3d-ic/thin_wafer_processing/laser_initiated_debonding
/en/solutions/cmos_image_sensors/
/en/solutions/cmos_image_sensors/introduction/
/en/solutions/cmos_image_sensors/backend_lithography/
/en/solutions/cmos_image_sensors/glass_bonding/
/en/solutions/cmos_image_sensors/oxide_bonding/
/en/solutions/cmos_image_sensors/anti_reflective_coatings/
/en/solutions/high_brightness_leds/
/en/solutions/high_brightness_leds/introduction/
/en/solutions/high_brightness_leds/layer_transfer/
/en/solutions/high_brightness_leds/imprint_lithography/
/en/solutions/high_brightness_leds/optical_lithography/
/en/solutions/high_brightness_leds/thin_wafer_handling/
/en/solutions/high_brightness_leds/anti_reflective_coatings/
/en/solutions/logic_memory/
/en/solutions/logic_memory/introduction/
/en/solutions/logic_memory/backend_lithography/
/en/solutions/logic_memory/wafer_level_bonding/
/en/solutions/logic_memory/c2w_bonding/
/en/solutions/logic_memory/thin_wafer_handling/
/en/solutions/mems_devices/
/en/solutions/mems_devices/introduction/
/en/solutions/mems_devices/lithography/
/en/solutions/mems_devices/first_level_packaging/
/en/solutions/microfluidics/
/en/solutions/microfluidics/patterning_processes/
/en/solutions/microfluidics/device_sealing/
/en/solutions/photonic_devices/
/en/solutions/photonic_devices/introduction/
/en/solutions/photonic_devices/imprint_lithography/
/en/solutions/photonic_devices/wafer_bonding_heterogeneous_integration/
/en/solutions/photonic_devices/ac2w_bonding/
/en/solutions/photonic_devices/anti_reflective_coatings/
/en/solutions/photovoltaics/
/en/solutions/photovoltaics/introduction/
/en/solutions/photovoltaics/imprint_lithography/
/en/solutions/photovoltaics/micro_optics/
/en/solutions/photovoltaics/wafer_bonding/
/en/solutions/photovoltaics/thin_pv_wafers/
/en/solutions/photovoltaics/spray_coating/
/en/solutions/photovoltaics/optical_lithography/
/en/solutions/saw_devices/
/en/solutions/saw_devices/introduction/
/en/solutions/saw_devices/wafer_level_bonding/
/en/solutions/soi_wafers/
/en/solutions/soi_wafers/introduction/
/en/solutions/soi_wafers/cleaning/
/en/solutions/soi_wafers/plasma_activation/
/en/solutions/soi_wafers/oxide_bonding/
/en/solutions/wafer_level_optics/
/en/solutions/wafer_level_optics/introduction/
/en/solutions/wafer_level_optics/imprint_lithography/
/en/solutions/wafer_level_optics/uv_bonding/
/en/solutions/wafer_level_optics/anti_reflective_coatings/
/en/markets/
/en/markets/overview
/en/markets/3dic_advanced_packaging/
/en/markets/compound/
/en/markets/mems/
/en/markets/nanotechnology/
/en/markets/soi_engineered_substrates/
/en/services/
/en/services/overview
/en/services/nilphotonics_competence_center/
/en/services/support/
/en/services/training/
/en/careers/
/en/contact/
/en/feedback
/en/sitemap
/en/imprint/
/en/terms_of_use/

Possible email addresses for evgroup.eu

info@evgroup.eu
email@evgroup.eu
support@evgroup.eu
contact@evgroup.eu
admin@evgroup.eu
postmaster@evgroup.eu
hostmaster@evgroup.eu
domain@evgroup.eu
abuse@evgroup.eu

Possible Domain Typos

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Evgroup.eu